scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (−) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 AD660S 16-Bit Serial/Byte DACPORT

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V_LL to DGND - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.3 V to +7 V dc V_CC to AGND - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.3 V to +17.0 V dc V_EE to AGND - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - +0.3 V to −17.0 V dc AGND to DGND - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±1 V Digital inputs (Pins 5-12 and 14-19) to DGND - - - - - - - - - - - - - −1.0 V to +7.0 V dc REF IN to AGND - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±10.5 V Span/Bipolar Offset to AGND - - - - - - - - - - - - - - - - - - - - - - ±10.5 V REF OUT, V_OUT - - - - - - - - - - - - - - - - - - - - - - - - - - - - Indefinite Short to AGND, DGND, V_CC, V_EE, and V_LL Power dissipation (P_D) at T_A = 60°C 2/ - - - - - - - - - - - - - - - - 1000 mW Storage temperature - - - - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering 10 sec) - - - - - - - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case - - - - - - - - - - - - - - - - - See MIL-STD-1835 Thermal resistance, junction-to-ambient: Case outline L - - - - - - - - - - - - - - - - - - - - - - - - - - - 80°C/W

V_LL max - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - +5 V dc V_CC/V_EE - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ±15 V dc Ambient operating temperature range - - - - - - - - - - - - - - - - - - −55°C to +125°C

intended Use: