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IPC-D-326

Information Requirements for Manufacturing Printed Boards and Other Electronic Assemblies

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Organization: IPC
Publication Date: 1 January 2004
Status: active
Page Count: 20
scope:

This document covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, and delivery and/or distribution of electronic assemblies.

Purpose

The purpose of this document is to outline an effective method of transferring product assembly information intercompany or from OEM to the assembler.

Classification

The level of assembly documentation that is required is dependent on both the overall complexity of the product and whether the assembly process must meet government, military or other regulatory agency requirements.

Document History

IPC-D-326
January 1, 2004
Information Requirements for Manufacturing Printed Boards and Other Electronic Assemblies
This document covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, and delivery and/or distribution of electronic...
April 1, 1991
Information Requirements for Manufacturing Printed Board Assemblies
A description is not available for this item.

References

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