GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
|Publication Date:||15 March 2006|
This report is focused on managing the maintenance and repair of soldered assemblies during the transition to lead-free technology. The terms lead-based and lead-free refer to alloys used in soldered assemblies.
This report provides guidance for:
•The transition to, and continued maintenance of, lead-free electronics including configuration control and identification of equipment, assemblies, and sub-assemblies.
•The roles and responsibilities of participants in the air transport industry.
•Using industry standards for developing a lead-free soldering program tailored to meet the specific requirements of the user.
•Developing programs, processes, and documentation for lead-free solder maintenance and repair.
This report is not a stand-alone document-it is intended to be used with the referenced industry standards and should be accepted throughout the air transport industry.
The equipment design documentation defines the basic parts and solder alloys used and is considered to be beyond the scope of this document.