scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 10H586 Max D master slave flip-flop with reset

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package F F-5 (16-lead, .440" × .285" × .085"), flat package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

Supply voltage range (V_EE) - - - - - - - - - - - −8.0 V dc minimum to 0.0 V dc maximum Input voltage range - - - - - - - - - - - - - - −5.2 V dc to 0.0 V dc Storage temperature range - - - - - - - - - - - −65°C to +165°C Lead temperature (soldering, 10 seconds) - - - - +300°C Junction temperature (T_J)- - - - - - - - - - - - +165°C Maximum power dissipation (P_D) - - - - - - - - - 705 mW Thermal resistance, junction-to-case (Θ_JC): See MIL-M-38510, appendix C

Supply voltage range (V_EE) - - - - - - - - - - - −5.46 V dc minimum to −4.94 V dc maximum Supply voltage range (V_CC) - - - - - - - - - - - −0.02 V to 0.02 V or 1.98 V to 2.02 V Ambient operating temperature range (T_A) - - - - −55°C to +125°C Minimum high level input voltage (V_IH): T_A = +25°C - - - - - - - - - - - - - - - - - −0.780 V T_A = +125°C - - - - - - - - - - - - - - - - - −0.650 V T_A = −55°C - - - - - - - - - - - - - - - - - - −0.840 V Maximum Low level input voltage (V_IL)- - - - - - −1.950 V

intended Use: