CENELEC - EN 61189-3
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)
inactive
| Organization: | CENELEC |
| Publication Date: | 1 April 1997 |
| Status: | inactive |
| Page Count: | 62 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
January 1, 2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
A description is not available for this item.
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.
EN 61189-3
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.