CENELEC - HD 323.2.58 S1
Environmental Testing - Part 2: Tests Test Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 January 1992 |
| Status: | active |
| Page Count: | 5 |
| ICS Code (Testing): | 19 |
Document History
HD 323.2.58 S1
January 1, 1992
Environmental Testing - Part 2: Tests Test Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
A description is not available for this item.
January 1, 1991
Basic Environmental Testing Procedures Part 2: Tests Test Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
A description is not available for this item.