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BSI - BS IEC 61163-2

Reliability stress screening - Part 2: Electronic components

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Organization: BSI
Publication Date: 15 February 1999
Status: inactive
Page Count: 32
ICS Code (Electronic components in general): 31.020

Document History

BS EN IEC 61163-2
May 31, 2020
Reliability stress screening Part 2: Components
A description is not available for this item.
BS IEC 61163-2
February 15, 1999
Reliability stress screening - Part 2: Electronic components
A description is not available for this item.

References

This document references:
IEC 60300-1 - Dependability management – Part 1: Guidance for management and application
Published by IEC on May 1, 2014
This part of IEC 60300 establishes a framework for dependability management. It provides guidance on dependability management of products, systems, processes or services involving hardware, software...
This document references:
IEC 61163-1 - Reliability stress screening – Part 1: Repairable assemblies manufactured in lots
Published by IEC on June 1, 2006
This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an...
This document references:
IEC 61709 - ELECTRIC COMPONENTS – RELIABILITY – REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
Published by IEC on October 1, 2019
A description is not available for this item.

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