DLA - SMD-5962-87656 REV A
MICROCIRCUIT, DIGITAL, FAST CMOS, OCTAL D-TYPE FLIP-FLOP WITH CLEAR, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 7 December 1989 |
| Status: | inactive |
| Page Count: | 12 |
scope:
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete part number shall be as shown in the following example:
The device types shall identify the circuit function as follows:
Device type Generic number Circuit function 01 54FCT273 Octal D-type flip-flop with clear, TTL compatible 02 54FCT273A Octal D-type flip-flop with clear, TTL compatible
The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:
Outline letter Case outline R D-8 (20-lead, 1.060" × .310" × .200") dual-in-line package S F-9 (20-lead, .540" × .300" × .100") flat package 2 C-2 (20-terminal, .358" × .358" × .100") square chip carrier package
Supply voltage range (VCC) - - - - - - - - - - - - −0.5 V dc to +6.0 V dc Input voltage range - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc Output voltage range - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc DC input diode current (IIK) - - - - - - - - - - - −20 mA DC output diode current (IOK) - - - - - - - - - - −50 mA DC output current - - - - - - - - - - - - - - - - ±100 mA Maximum power dissipation (PD) - - - - - - - - - - 500 mA Thermal resistance (θJC) - - - - - - - - - - - - - See MIL-M-38510, appendix C Storage temperature range - - - - - - - - - - - - −65°C to +150°C Junction temperature (TJ) - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds) - - - - - +300°C
Supply voltage range (VCC) - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum low level input voltage (VIL)- - - - - - - - - 0.8 V dc Minimum high level input voltage (VIH) - - - - - - - - 2.0 V dc Case operating temperature range (TC)- - - - - - - - - −55°C to +125°C Minimum setup time, high to low (Data to CP) (ts): Device type 01 - - - - - - - - - - - - - - - - - - - 3.5 ns Device type 02 - - - - - - - - - - - - - - - - - - - 3.0 ns Minimum hold time, high to low (Data to CP) (th): Device type 01 - - - - - - - - - - - - - - - - - - - 2.5 ns Device type 02 - - - - - - - - - - - - - - - - - - - 2.0 ns Minimum CP pulse width, high or low (tpw): Device type 01 - - - - - - - - - - - - - - - - - - - 7.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - 6.0 ns Minimum removal time, [M bar] to CP (tREM): Device type 01 - - - - - - - - - - - - - - - - - - - 5.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - 3.0 ns Minimum [M bar][R bar] pulse width, high or low (tp): Device type 01 - - - - - - - - - - - - - - - - - - - 7.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - 6.0 ns
intended Use:
Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More
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