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IPC - TM-650 2.3.23.1A

Cure (Permanency) UV Initiated Dry Film Solder Masks

inactive, Most Current
Organization: IPC
Publication Date: 1 February 1988
Status: inactive
Page Count: 2
scope:

This test method covers the cure, or permanence testing of ultraviolet-initiated dry film solder mask (solder resist) organic coatings. Dry film solder masking is the application of a film coating on laminates and circuits. Following processing and curing, the dry film mask covers only those areas where no solder is to appear and, conversely, does not cover those areas where soldering is intended.

Document History

TM-650 2.3.23.1A
February 1, 1988
Cure (Permanency) UV Initiated Dry Film Solder Masks
This test method covers the cure, or permanence testing of ultraviolet-initiated dry film solder mask (solder resist) organic coatings. Dry film solder masking is the application of a film coating on...

References

This document is referenced by:
MIL-PRF-55110 - PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
Published by NPFC on May 16, 2020
Scope. This specification establishes the performance and qualification requirements for rigid single-sided, double-sided, and multilayered printed wiring boards with or without plated through holes...
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