scope:

This drawing forms a part of a one part - one pert number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 LMF90 4th-order elliptic notch filter

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-,38510, and as listed below.

Outline letter Case/outline C D-1 (14-lead, .785" × .310" × .200"), dual-in-line package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V⁺ to V⁻) 2/ - - - - - - - - - - - - - - - - −0.3 V to +16 V Voltage at any input or output 2/- - - - - - - - - - - - - - V⁻ −0.3 V to V⁺ +0.3 V Input current at any pin 3/ - - - - - - - - - - - - - - - - 5 mA Package input current (I_IN) 3/ - - - - - - - - - - - - - - - 20 mA Power dissipation (P_D) - - - - - - - - - - - - - - - - - - - 500 mW Storage temperature range - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - +300°C Junction temperature (T_J) - - - - - - - - - - - - - - - - - +150°C Thermal resistance, junction-to-case (Θ_JC) - - - - - - - - - See MIL-M-38510, appendix C Thermal resistance, junction-to-ambient (Θ_JA) - - - - - - - 59° C/W board mounted

Supply voltage (V⁺ to V⁻)- - - - - - - - - - - - - - - - - - 4.0 V to 15.0 V Ambient operating temperature range (T_A) - - - - - - - - - - −55°C to +125°C

intended Use: