scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following examples.

For device classes M and Q:

For device class V:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash(-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54AC158 Quad 2-input multiplexer

The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device.

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)............................................ −0.5 V dc to +6.0 V dc DC input voltage range (V_IN).......................................... −0.5 V dc to V_CC+0.5 V dc DC output voltage range (V_OUT)........................................ −0.5 V dc to V_CC+0.5 V dc Clamp diode current (I_IK, I_OK)........................................ ±20 mA DC output current (per pin)........................................... ±50 mA DC V_CC or GND current (per pin)....................................... ±100 mA Maximum power dissipation (P_D)........................................ 500 mW Storage temperature range (T_STG)...................................... −65°C to +150°C Lead temperature (soldering, 10 seconds).............................. +300°C Thermal resistance, junction-to-case (Θ_JC)............................ See MIL-STD-1835 Junction temperature (T_J)............................................. +175°C 4/

Supply voltage range (V_CC)............................................. +3.0 V dc to +5.5 V dc Input voltage range(V_IN)............................................... +0.0 V dc to V_CC Output voltage range (V_OUT)............................................ +0.0 V dc to V_CC Minimum high level input voltage (V_IH): V_CC = 3.0 V............................................................ 2.10 V dc V_CC = 4.5 V............................................................ 3.15 V dc V_CC = 5.5 V............................................................ 3.85 V dc Maximum low level input voltage (V_IL): V_CC = 3.0 V............................................................ 0.90 V dc V_CC = 4.5 V............................................................ 1.35 V dc V_CC = 5.5 V............................................................ 1.65 V dc Case operating temperature range (T_C)................................... −55°C to +125°C Input rise or fall times (V_CC = 3.6 V to 5.5 V)......................... 0 to 8 ns/V

intended Use: