IEC 60749-22
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 22: Bond strength CORRIGENDUM 1
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| Organization: | IEC |
| Publication Date: | 1 August 2003 |
| Status: | active |
| Page Count: | 51 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
IEC 60749-22
August 1, 2003
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 22: Bond strength CORRIGENDUM 1
A description is not available for this item.
September 1, 2002
Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength
A description is not available for this item.