DS/EN 60191-6-10
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
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| Organization: | DS |
| Publication Date: | 23 December 2003 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60191 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).
Document History
June 14, 2005
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
This part of 60191 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (P-VSON).
DS/EN 60191-6-10
December 23, 2003
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
This part of IEC 60191 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called...
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