DLA - SMD-5962-93261 REV B
MICROCIRCUIT, LINEAR, VOLTAGE REGULATOR, HIGH POWER FACTOR, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 16 August 1995 |
| Status: | inactive |
| Page Count: | 14 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 UC1854 Voltage preregulator, high power factor 02 UC1854B Voltage preregulator, high power factor 03 UC1854A Voltage preregulator, high power factor
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line 2 CQCC1-N20 20 square leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (VCC): Device type 01 . . . . . . . . . . . . . . . . . 35 V dc Device type 02 . . . . . . . . . . . . . . . . . 22 V dc GTDRV current, continuous . . . . . . . . . . . . 0.5 A GTDRV current, 50 percent duty cycle . . . . . . . 1.5 A Input voltage, VSENSE, VRMS . . . . . . . . . . . 11 V dc Input voltage, ISENSE, MULTOUT . . . . . . . . . . 11 V dc Input voltage, PKLMT. . . . . . . . . . . . . . . 5 V dc Input current, RSET, IAC, ENA, PKLMT . . . . . . . 10 mA Power dissipation TA = +25°C (PD). . . . . . . . . 1 W 4/ Thermal resistance, Junction-to-case (ΘJC) . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (ΘJA). . . 80°C/W Storage temperature range . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . +300°C Junction temperature (TJ) . . . . . . . . . . . . +150°C
Supply voltage . . . . . . . . . . . . . . . . . . 18 V dc Ambient operating temperature range (TA) . . . . . 55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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