This document references:
IPC-D-350 - Printed Board Description in Digital Form
Published by IPC
on
July 1, 1992
This standard specifies record formats used to describe printed board products with detail sufficient for tooling, manufacturing and testing requirements. These formats may be used for transmitting...
This document references:
IEEE 91 - IEEE Standard for Graphic Symbols for Logic Functions
Published by IEEE
on
June 27, 1991
This standard contains graphic symbols for representing logic functions or physical devices capable of carrying out logic functions. Descriptions of logic functions, the graphic representation of...
This document references:
IPC-CM-770 - Guidelines for Printed Board Component Mounting
Published by IPC
on
January 1, 2004
Chip-On-Flex (COF) – Surface mounted chip attached directly onto flexible printed boards. Chip-On-Glass (COG) – An assembly technology that uses an unpackaged semiconductor die mounted directly on a...
This document references:
IPC-D-350 - Printed Board Description in Digital Form
Published by IPC
on
July 1, 1992
This standard specifies record formats used to describe printed board products with detail sufficient for tooling, manufacturing and testing requirements. These formats may be used for transmitting...
This document is referenced by:
IPC-PD-335 - Electronic Packaging Handbook
Published by IPC
on
December 1, 1989
Purpose of the IPC Electronic Packaging Handbook The purpose of this Electronic Packaging Handbook is to provide the appropriate insight and flows into the multifaceted topic of electronic packaging....
