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IPC - 7711 5.3.1

Chip Installation Solder Paste Method/Hot Air Pencil

inactive, Most Current
Organization: IPC
Publication Date: 1 February 1998
Status: inactive
Page Count: 2

Document History

7711 5.3.1
February 1, 1998
Chip Installation Solder Paste Method/Hot Air Pencil
A description is not available for this item.

References

This document is replaced by:
IPC-7711/7721 - Rework, Modification and Repair of Electronic Assemblies Amendment 1
Published by IPC on July 1, 2020
A description is not available for this item.
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