scope:

This specification covers the detail requirements for monolithic silicon, Schottky TTL, static 576 bit random access memory microcircuits. Three product assurance classes and a choice of case outline/lead finish are provided and are reflected in the complete part number.

The part number shall be in accordance with MIL-M-38510.

The device type shall be as follows:

Device type Circuit 01 64×9 bit RAM, uncommitted to collector

Device class shall be the product assurance level as defined in MIL-M-38510.

The case outline shall be designated as follows:

Letter Case outline (see MIL-M-38510, appendix C) X See figure 1B (28-lead, 1 7/16" × ½" dual-in-line pack) Y See figure 1C (28-lead, ⅜" × 9/16" flat-pack) Z See figure 1A (28-terminal, .45" × .45" chip carrier)

Supply voltage range- - - - - - - - - - - - - −0.5 to 7.0 Vdc Input voltage range - - - - - - - - - - - - - −0.5 to +5.5 Vdc Storage temperature range - - - - - - - - - - −65° to +150°C Maximum power dissipation, P_D Device type 01- - - - - - - - - - - - - - - 935 mW, l/ Voltage applied to outputs (output high)- - - −0.5 to +5.5 Vdc Output current (output low) - - - - - - - - - +20 mA Input current - - - - - - - - - - - - - - - - −12 to +5.0 mA Lead temperature (soldering 10 seconds) - - - 300°C Junction temperature- - - - - - - - - - - - - T_J = 175°C

Supply voltage- - - - - - - - - - - - - - - - 4.5 Vdc minimum to 5.5 Vdc maximum Minimum high level input voltage- - - - - - - 2.4 Vdc Maximum low level input voltage - - - - - - - 0.4 Vdc Case operating temperature range- - - - - - - −55° to 125°C

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Air Development Center, RADC (RBE-2), Griffiss AFB, NY 13440, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

intended Use:

Microcircuits comforming to this specification are intended for original equipment design applications and logistic support of existing equipment.