CENELEC - EN 60749-21
Semiconductor devices Mechanical and climatic test methods Part 21: Solderability
inactive
| Organization: | CENELEC |
| Publication Date: | 1 February 2005 |
| Status: | inactive |
| Page Count: | 24 |
| ICS Code (Semiconductor devices): | 31.080 |
Document History
August 1, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or...
EN 60749-21
February 1, 2005
Semiconductor devices Mechanical and climatic test methods Part 21: Solderability
A description is not available for this item.