scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Frequency 01 80287-10 80-bit HMOS numeric 10 MHz processor extension 02 80287-8 80-bit HMOS numeric 8 MHz processor extension 03 80287-6 80-bit HMOS numeric 6 MHz processor extension

The case outline shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline Q D-5 (40-lead, 9/16" × 2 1/16"), dual-in-line package

Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Voltage on any pin with respect to ground - - - - - - −1.0 V dc to +7 V dc Maximum power dissipation (P_D)- - - - - - - - - - - - 3.15 W Lead temperature (soldering, 10 seconds)- - - - - - - 300°C Thermal resistance junction-to-case (θ_JC)- - - - - - - See MIL-M-38510, appendix C Junction temperature (T_J) - - - - - - - - - - - - - - 150°C

Case operating temperature range- - - - - - - - - - - −55°C to +125°C Supply voltage (V_CC)- - - - - - - - - - - - - - - - - 4.75 V dc to 5.25 V dc

intended Use: