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IPC-CM-770

Guidelines for Printed Board Component Mounting

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Organization: IPC
Publication Date: 1 January 1996
Status: inactive
Page Count: 176

Document History

January 1, 2004
Guidelines for Printed Board Component Mounting
Chip-On-Flex (COF) – Surface mounted chip attached directly onto flexible printed boards. Chip-On-Glass (COG) – An assembly technology that uses an unpackaged semiconductor die mounted directly on a...
IPC-CM-770
January 1, 1996
Guidelines for Printed Board Component Mounting
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