DLA - SMD-5962-95504
MICROCIRCUIT, LINEAR, RAIL-TO-RAIL, DUAL/QUAD OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 20 October 1994 |
| Status: | inactive |
| Page Count: | 13 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 TLV2262M Rail-to-rail dual operational amplifier 02 TLV2264M Rail-to-rail quad operational amplifier
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack H GDFP1-F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VDD) . . . . . . . . . . . . . −0.5 V dc to +8.0 V dc 2/ Differential input voltage (VID) . . . . . . . . . . −8.0 V to +8.0 V 3/ Input voltage range (VIN) . . . . . . . . . . . . . . . −VDD − 0.3 V to +VDD 2/ Input current, each input (IIN) . . . . . . . . . . . . +5.0 mA to −5.0 mA Output current (IOUT) . . . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Total current into +VDD . . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Total current out of −VDD . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Duration of short-circuit current at or below +25°C . . Unlimited 4/ Maximum power dissipation (PD): 5/ Cases C and 2 . . . . . . . . . . . . . . . . . . . . 1375 mW Cases D and H . . . . . . . . . . . . . . . . . . . . 700 mW Case P . . . . . . . . . . . . . . . . . . . . . . . 1050 mW Maximum junction temperature (TJ) . . . . . . . . . . . +150°C Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering 10 seconds) . . . . . . . . +260°C Thermal resistance, junction-to-case (ΘJC) . . . . . . See MIL-STD-1835
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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