scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Bin Speed 01 1425A 2500 gate, field programmable gate array 82.3 ns 02 1425A-1 2500 gate, field programmable gate array 70 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA5 - PN 133 Pin grid array Y See figure 1 132 Flat pack

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

DC Supply voltage range (V_DO) - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range (V_I) - - - - - - - - - - - - - - - - −0.5 V dc to V_DO + 0.5 V dc Output voltage range (V_O) - - - - - - - - - - - - - - - - −0.5 V dc to V_DO + 0.5 V dc I/O Source/Sink current (I_IO) - - - - - - - - - - - - - - ±20 mA Storage temperature range (T_SIG) - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering 10 seconds) - - - - - - - - - 300°C Thermal resistance, junction-to-case (Θ_JC): Case X - - - - - - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Case Y - - - - - - - - - - - - - - - - - - - - - - - - 11°C/W 2/ Maximum junction temperature (T_J) - - - - - - - - - - - - +175°C

Supply voltage (V_DO) - - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Case operating temperature range (T_C) - - - - - - - - - - −55°C to +125°C

intended Use: