scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54FCT573 Octal transparent latch with three-state outputs, TTL compatible 02 54FCT573A Octal transparent latch with three-state outputs, TTL compatible

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline R D-8 (20-lead, 1.060" × .310" × .200"), dual-in-line package S F-9 (20-lead, .540" × .300" × .100"), flat package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

Supply voltage (V_CC) - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range 2/ - - - - - - - - - - - - - - −0.5 V dc to V_CC +0.5 V dc Output voltage range 2/- - - - - - - - - - - - - - −0.5 V dc to V_CC +0.5 V dc DC input diode current (I_IK) - - - - - - - - - - - −20 mA DC output diode current (I_OK) - - - - - - - - - - −50 mA DC output current - - - - - - - - - - - - - - - - ±100 mA Power dissipation (P_D) 3/ - - - - - - - - - - - - 500 mW Thermal resistance (θ_JC) - - - - - - - - - - - - - See MIL-M-38510, appendix C Storage temperature - - - - - - - - - - - - - - - −65°C to +150°C Junction temperature (T_J)- - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds) - - - - - +300°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum logic low voltage (V_{IL)- - - - - - - - - -} 0.8 V dc Minimum logic high voltage (V_IH) - - - - - - - - - 2.0 V dc Case operating temperature (T_C)- - - - - - - - - - −55°C to +125°C Minimum setup time, high or low (D_n to LE) (t_s)- - 2.0 ns Minimum hold time, high or low (D_n to LE) (t_h) - - 1.5 ns Minimum LE pulse width, high or low (t_w) - - - - - 6.0 ns

intended Use: