scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The Complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 (See 6.6) 256 × 4 CMOS static RAM 15 ns 02 (See 6.6) 256 × 4 CMOS static RAM 35 ns 03 (See 6.6) 256 × 4 CMOS static RAM 25 ns

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline K F-6 (24-lead, .640" × .420" × .090"), flat package W D-7 (22-lead, 1.111" ×.410" × .225"), dual-in-line package X C-3 (24-terminal, .410" × .410" × .100"), square chip carrier package

Supply voltage to ground potential - - - - - - - - - −0.5 V dc to +7.0 V dc DC voltage applied to outputs- - - - - - - - - - - - −0.5 V dc to V_CC +0.5 V dc DC input voltage - - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC +0.5 V dc Output current into outputs (low)- - - - - - - - - - 20 mA Storage temperature range- - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) 1/ - - - - - - - - - 495. mW 1/ Lead temperature .(soldering, 10 seconds) - - - - - +260°C Thermal resistance, junction-to-case (θ_JC): Cases W, X, and K - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (T_J)- - - - - - - - - - - - - - +175°C Latchup current- - - - - - - - - - - - - - - - - - - >200 mA

Supply voltage (V_CC) - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Minimum high level input voltage (V_IH) - - - - 2.1 V dc Maximum low level input voltage (V_IL)- - - - - 0.8 V dc Case operating temperature range (T_C)- - - - - −55°C to +125°C

intended Use: