IPC - TM-650 2.4.10
Plating Adhesion
inactive, Most Current
| Organization: | IPC |
| Publication Date: | 1 April 1973 |
| Status: | inactive |
| Page Count: | 1 |
scope:
To test the adhesion of plating on printed wiring conductor patterns.
Document History
TM-650 2.4.10
April 1, 1973
Plating Adhesion
To test the adhesion of plating on printed wiring conductor patterns.