scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54CDC586 3.3 V Phase Lock Loop Clock Driver with 3- State Outputs, TTL Compatible Inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDFP1-F56 56 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)........................................................ −0.5 V dc to +4.6 V dc DC input voltage range (V_IN) ..................................................... −0.5 V dc to +7.0 V dc 4/ Voltage range applied to any output in the high state or power-off state (V_OUT)............................................ −0.5 V dc to V_CC + 0.5 V dc 4/ Current into any output in the low state, I_O...................................... +64 mA DC input clamp current (I_IK) (V_IN < 0.0).......................................... −20 mA DC output clamp current (I_OK) (V_OUT < 0.0)........................................ −50 mA Maximum power dissipation at T_A = +55°C (in still air) (P_D)....................... 1.2 W 5/ Storage temperature range (T_STG).................................................. −65°C to +150°C Lead temperature (soldering, 10 seconds).......................................... +300°C Thermal resistance, junction-to-case (Θ_JC)........................................ See MIL-STD-1835 Junction temperature (T_J)......................................................... 175°C

Supply voltage range (V_CC)........................................................ +3.0 V dc to +3.6 V dc Minimum high level input voltage (V_IH)............................................ +2.0 V Maximum low level input voltage (V_IL)............................................. +0.8 V Input voltage range (V_IN)......................................................... +0.0 V dc to 5.5 V dc Maximum high level output current (I_OH)........................................... −32 mA Maximum low level output current (I_OL)............................................ +32 mA Case operating temperature range (T_C)............................................. −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012).................................... XX percent 7/

intended Use: