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IEC 60749-22

Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength

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Organization: IEC
Publication Date: 1 September 2002
Status: active
Page Count: 50
ICS Code (Semiconductor devices in general): 31.080.01

Document History

August 1, 2003
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 22: Bond strength CORRIGENDUM 1
A description is not available for this item.
IEC 60749-22
September 1, 2002
Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength
A description is not available for this item.

References

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