scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 See 6.6 512 × 9 FIFO 80 ns 02 See 6.6 512 × 9 FIFO 65 ns 03 See 6.6 512 × 9 FIFO 50 ns 04 See 6.6 512 × 9 FIFO 40 ns 05 See 6.6 512 × 9 FIFO 30 ns 06 See 6.6 512 × 9 FIFO 25 ns

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline X D-10 (28-lead, 1.490" × .610" × .232"), dual-in-line package Y D-15 (28-lead, 1.485" × .310" × .230"), dual-in-line package Z C-12 (32-terminal, .560" × .458" × .120"), rectangular chip carrier package U F-11 (28-lead, .740" × .380" × .090"), flat package

Supply voltage to ground potential - - - - - - - −0.5 V dc to +7.0 V dc DC voltage applied to outputs in high Z state - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - −3.0 V dc to +7.0 V dc DC output current - - - - - - - - - - - - - - - 20 mA Maximum power dissipation 1/ - - - - - - - - - 1.0 W Lead temperature (soldering, 10 seconds) - - - - +260°C Thermal resistance, junction-to-case (θ_JC): - - See MIL-M-38510, appendix C Junction temperature (T_J) 2/ - - - - - - - - - +150°C Storage temperature range - - - - - - - - - - - −65°C to +15O°C Temperature under bias - - - - - - - - - - - - - −55°C to +125°C

Supply voltage (V_CC) - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Ground voltage (GND) - - - - - - - - - - - - - - 0 V dc Input high voltage (V_IH) - - - - - - - - - - - - 2.2 V dc minimum Input low voltage (V_IL) - - - - - - - - - - - - 0.8 V dc maximum Case operating temperature range (T_C) - - - - - −55°C to +125°C

intended Use: