scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 87C451 CMOS 8-bit EPROM microcontroller

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style M GQCC1-J68 68 Leaded chip carrier package X CDIP1-T64 64 Dual-in-line package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC to V_SS) . . . . . . . . . . . . . . . −0.5 V dc to +6.5 V dc Voltage (any pin) to V_SS (except V_PP) . . . . . . . . . . . . . −0.5 V dc to V_CC + 0.5 V dc Voltage on V_PP . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +13.0 V dc Storage temperature range . . . . . . . . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation (P_D) . . . . . . . . . . . . . . . . 200 mW Lead temperature (soldering, 5 seconds) . . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . . . . . See MIL-STD-1835

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . 4.5 V dc to 5.5 V dc Maximum low level input voltage: All inputs except [E bar][A bar] . . . . . . . . . . . . . . . . . . . . 0.2 V_CC − 0.25 V dc [E bar][A bar] . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.2 V_CC − 0.45 V dc Minimum high level input voltage: All inputs except XTAL1, RST . . . . . . . . . . . . . . . . 0.2 V_CC + 1.1 V dc XTAL1, RST . . . . . . . . . . . . . . . . . . . . . . . . . . 0.7 V_CC + 0.2 V dc Case operating temperature range (T_C) . . . . . . . . . . . . . −55°C to +125°C Oscillator frequency . . . . . . . . . . . . . . . . . . . . . 3.5 MHz to 12 MHz

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . XX percent 2/

Fault covereage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . XX percent 2/

intended Use: