DLA - SMD-5962-93060 REV A
MICROCIRCUIT, LINEAR, A/D CONVERTER, 12-BIT, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 15 November 1993 |
| Status: | inactive |
| Page Count: | 12 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 AD872SD 12-bit, 10 MSPS A/D converter 02 AD872SE 12-bit, 10 MSPS A/D converter
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line Y CQCC1-N44 44 Square leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
AVDD range with respect to AGND . . . . . . . . . . . . . . . . −0.5 V to 6.5 V AVSS range with respect to AGND . . . . . . . . . . . . . . . . −6.5 V to 0.5 V DVDD range with respect to DGND . . . . . . . . . . . . . . . . −0.5 V to 6.5 V AGND range with respect to DGND . . . . . . . . . . . . . . . . −1.0 V to 1.0 V AVDD range with respect to DVDD . . . . . . . . . . . . . . . . −6.5 V to 6.5 V Clock input range, OEN with respect to DGND . . . . . . . . . . −0.5 V to DVDD + 0.5 V Digital outputs range with respect to DGND . . . . . . . . . . −0.5 V to DVDD + 0.3 V VINA, VINB, REF IN range with respect to AGND . . . . . . . . . −6.5 V to 6.5 V REF IN range with respect to AVDD . . . . . . . . . . . . . . . AVSS to 0 V REF IN range with respect to AVSS . . . . . . . . . . . . . . . 0 V to AVDD Power dissipation (PD) . . . . . . . . . . . . . . . . . . . . 1.3 W Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . +150°C Storage temperature range . . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (10 seconds) . . . . . . . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (ΘJC) . . . . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (ΘJA): Case outline X . . . . . . . . . . . . . . . . . . . . . . . 60°C/W Case outline Y . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
Operating ambient temperature range (TA) . . . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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