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IEC 61192-3

Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies

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Organization: IEC
Publication Date: 1 December 2002
Status: inactive
Page Count: 102
ICS Code (Electronic component assemblies): 31.190
scope:

This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

It applies to assemblies that are totally through-hole or mixed assemblies that include surfacemounting or other related assembly technologies, for example, terminals, wires.

Document History

IEC 61192-3
December 1, 2002
Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies
This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the...

References

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