Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies
|Publication Date:||1 December 2002|
|ICS Code (Electronic component assemblies):||31.190|
This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.
It applies to assemblies that are totally through-hole or mixed assemblies that include surfacemounting or other related assembly technologies, for example, terminals, wires.