IEC 61192-3
Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies
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| Organization: | IEC |
| Publication Date: | 1 December 2002 |
| Status: | inactive |
| Page Count: | 102 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.
It applies to assemblies that are totally through-hole or mixed assemblies that include surfacemounting or other related assembly technologies, for example, terminals, wires.
Document History
IEC 61192-3
December 1, 2002
Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies
This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the...