scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with complaint non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specific RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 DG441A Quad, SPST analog switch 02 DG442A Quad, SPST analog switch

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V+ to V− . . . . . . . . . . . . . . . . . . . . . . . 44 V dc GND to V−. . . . . . . . . . . . . . . . . . . . . . . 25 V dc Digital inputs to V− 2/. . . . . . . . . . . . . . . . (GND − 0.3 V dc) to 44 V dc V_S, V_D to V− 2/ . . . . . . . . . . . . . . (V−) −2 V dc to (V+) +2 V dc or 30 mA, whichever occurs first Current (any terminal), continuous . . . . . . . . . . 30 mA Current, S or D, pulsed, 1 ms, 10 percent duty cycle . 40 mA Power dissipation (P_D): 3/ Case outline E at +75°C . . . . . . . . . . . . . . 900 mW Case outline 2 at +75°C . . . . . . . . . . . . . . 750 mW Junction temperature (T_J). . . . . . . . . . . . . . . +175°C Lead temperature (soldering, 10 seconds maximum) . . . +300°C Storage temperature range . . . . . . . . . .. . . . . −65°C to +150°C

V+ . . . . . . . . . . . . . . . . . . . . . . . . . . +15 V dc V− . . . . . . . . . . . . . . . . . . . . . . . . . . −15 V dc GND. . . . . . . . . . . . . . . . . . . . . . . . . . 0 V dc Ambient operating temperature range. . . . . . . . . . −55°C to +125°C

intended Use: