scope:

This series of European Specifications specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. This specification also gives recommendations for the general industry good practice in the use of bare die, with or without connection structures, and minimally packaged die. This part specifies the vocabulary and definitions which are used throughout other parts of the Specification. It should be read in conjunction with ES 59008-1: General requirements.