scope:

This technical report reports processes that exist for using semiconductor devices in wider temperature ranges than those specified by the device manufacturer.

This technical report reports on applications in which only the performance of the device is an issue. Even though the device is used at wider temperatures, the wider temperatures will be limited to those that do not compromise the system performance or application-specific reliability of the device in the application. Specifically, this technical report does not report on applications that require the device to function beyond the absolute maximum rating limits of the component specified by the manufacturer and with a margin to be considered.

NOTE Alternate means of thermal uprating may have been performed prior to the implementation reported in this technical report by the equipment manufacturer. Rationale for decisions made may have been valid considering the application, semiconductor market conditions, experience with the particular component manufacturer, etc. at the times these decisions were made. Field performance using these methods also may validate their use, however, their continued use should take into account the risk of changes to the subject devices such as feature size reductions, material changes, etc.