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IPC-2225

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

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Organization: IPC
Publication Date: 1 May 1998
Status: active
Page Count: 32
scope:

This standard establishes requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of organic mounting structure used to interconnect chip components, which in combination form the completed functional Single Chip Module (SCM-L), MCM, or MCM-L assemblies.

 

Document History

IPC-2225
May 1, 1998
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
This standard establishes requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of organic mounting structure used to interconnect chip...

References

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