NPFC - MIL-T-81955
TIN PLATING, IMMERSION FOR COPPER AND COPPER ALLOYS
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| Organization: | NPFC |
| Publication Date: | 7 October 1982 |
| Status: | active |
| Page Count: | 1 |
Document History
MIL-T-81955
October 7, 1982
TIN PLATING, IMMERSION FOR COPPER AND COPPER ALLOYS
A description is not available for this item.
July 14, 1982
TIN PLATING, IMMERSION FOR COPPER AND COPPER ALLOYS
A description is not available for this item.
November 15, 1973
TIN PLATING, IMMERSION FOR COPPER AND COPPER ALLOYS
The tin plating covered in this specification is intended for use as a base for soldering printed circuitry and microwave parts and components. The thin plating, ranging up to 100 millionths of an...