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IEC 61760-1

Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)

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Organization: IEC
Publication Date: 1 April 2006
Status: inactive
Page Count: 36
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This International Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.

Object

The object of this standard is to ensure that a wide variety of SMDs (passive and active) can be subjected to the same placement and mounting processes during assembly. This standard defines tests and requirements that need to be part of any SMD component general, sectional or detail specification. In addition, this standard provides component users and manufacturers with a reference set of typical process conditions used in surface mount technology.

Document History

IEC 61760-1
July 1, 2020
Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set...
IEC 61760-1
April 1, 2006
Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
This International Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for...
IEC 61760-1
August 1, 1998
Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
A description is not available for this item.

References

This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
IEC 60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Published by IEC on January 1, 2019
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
This document references:
IEC 60068-2-77 - Environmental Testing - Part 2-77: Tests - Test 77: Body Strength and Impact Shock
Published by IEC on January 1, 1999
Scope and object This part of IEC 60068 provides test methods applicable to surface mounting devices (SMDs) made of glass or sintered materials such as capacitors, resistors and inductors...
This document references:
IEC 60068-2-21 - Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices
Published by IEC on January 1, 2012
This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or...
This document is referenced by:
BS EN 62137-1-4 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
Published by BSI on March 31, 2009
A description is not available for this item.
This document is referenced by:
EN 62137-3 - Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Published by CENELEC on January 1, 2012
This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array...
This document is referenced by:
BS EN 61810-1 - Electromechanical elementary relays Part 1: General and safety requirements
Published by BSI on April 30, 2015
A description is not available for this item.
This document is referenced by:
BS EN 140401 - Blank Detail Specification: Fixed low power film surface mount (SMD) resistors
Published by BSI on June 30, 2009
A description is not available for this item.
This document is referenced by:
BS EN 60539-1 - Directly heated negative temperature coefficient thermistors Part 1: Generic specification
Published by BSI on August 31, 2016
A description is not available for this item.
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