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IEC 61760-1

Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)

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Organization: IEC
Publication Date: 1 April 2006
Status: inactive
Page Count: 36
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This International Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.

Object

The object of this standard is to ensure that a wide variety of SMDs (passive and active) can be subjected to the same placement and mounting processes during assembly. This standard defines tests and requirements that need to be part of any SMD component general, sectional or detail specification. In addition, this standard provides component users and manufacturers with a reference set of typical process conditions used in surface mount technology.

Document History

July 1, 2020
Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set...
IEC 61760-1
April 1, 2006
Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
This International Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for...
August 1, 1998
Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
A description is not available for this item.

References

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