scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) Levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA Levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Propagation delay 01 29C525 16 × 8-bit, variable delay 1-16 stage 25 ns 02 29C525 16 × 8-bit, variable delay 1-16 stage 20 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline U F-11 (28-lead, .740" × .380" × .090"), flat Pack X D-15 (28-lead, 1.485" × .310" × .230"), dual-in-line package Y See figure 1 (28-lead, 1.485" × .410" × .230"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100"), square leadless chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature range - - - - - - - - - - - - - - - - - - - −65°C to +150°C V_CC supply voltage with respect to ground range - - - - - - - - −0.5 V to +7.0 V Input signal with respect to ground range - - - - - - - - - - - −0.5 V to V_CC + 0.5 Signal applied to high impedance output range - - - - - - - - - −0.5 V to V_CC + 0.5 Output current into low outputs - - - - - - - - - - - - - - - - 25 mA Power dissipation (P_D) - - - - - - - - - - - - - - - - - - - - - 110 mW Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - 300°C Junction temperature - - - - - - - - - - - - - - - - - - - - - - 175°C Thermal resistance, junction-to-case: Case Y - - - - - - - - - - - - - - - - - - - - - - - - - - - - 35°C/W Cases U, X, 3 - - - - - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - - - - - 4.5 V ≤ V_CC ≤ 5.5 V Operating case temperature (T_C) - - - - - - - - - - - - - - - - −55°C to +125°C Maximum high level input voltage (V_IH) - - - - - - - - - - - - - 2.0 V Maximum low level input voltage (V_IL)- - - - - - - - - - - - - - 0.8 V

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - XX percent 2/

intended Use: