scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 AD667 12-bit voltage output D/A converter, microprocessor compatible

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline X D-10 (28-lead, 1.490" × .610" × .232"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × ,100"), square chip carrier package

V_CC to power ground range - - - - - - - - - - - - - - 0 V dc to +18 V dc V_EE to power ground range - - - - - - - - - - - - - - 0 V dc to −18 V dc Digital inputs (pins 11-15, 17-28) to power ground range - - - - - - - - - - - - - - - - - - - - - - - - −1.0 V dc to 7.0 V dc Reference in to reference ground- - - - - - - - - - - ±12 V dc Bipolar offset to reference ground- - - - - - - - - - ±12 V dc 10 V span R to reference ground - - - - - - - - - - - ±12 V dc 20 V span R to reference ground - - - - - - - - - - - ±24 V dc Reference out, V_OUT (pins 6 and 9)- - - - - - - - - - Continuous short to power ground, momentary short to V_CC Power dissipation (P_D)- - - - - - - - - - - - - - - - 1,000 mW 1/ Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds)- - - - - - - +300°C Thermal resistance, junction-to-case (Θ_JC)- - - - - - See MIL-M-38510, appendix C Thermal resistance, junction-to-ambient (Θ_JA): Case outline X - - - - - - - - - - - - - - - - - - 60°C/W Case outline 3 - - - - - - - - - - - - - - - - - - 125°C/W

Supply voltage range (V_CC) - - - - - - - - - - - - - +11.4 V dc to +16.5 V dc Supply voltage range (V_EE) - - - - - - - - - - - - - −11.4 V dc to −16.5 V dc Ambient operating temperature range (T_A) - - - - - - −55°C to +125°C

intended Use: