scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuit 8 in accordance with 1.2.1 of MIL-STD-883. "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices." When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as in the following example:

Device classes M, B, and S RHA marked devises shall meet the MIL-M-38510 specified RHA levels end shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Propagation delay 01 LPR520 4 × 16-bit multilevel pipeline register 30 ns 02 LPR520 4 × 16-bit multilevel pipeline register 24 ns 03 LPRS20 4 × 16-bit multilevel pipeline register 18 ns 04 LPR521 4 × 16-bit multilevel pipeline register 30 ns 05 LPR521 4 × 16-bit multilevel pipeline register 24 ns 06 LPR521 4 × 16-bit multilevel pipeline register 18 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline Q D-5 (40-lead 2.096" × .620" × .225"), dual-in-line package X C-5 (44-terminal .662" × .662" × .120"), leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature - - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Operating ambient temperture - - - - - - - - - - - - - - - - - - - −55°C to +125°C V_CC supply voltage (referenced to ground) - - - - - - - - - - - - - −0.5 V to +7.0 V Input signal (referenced to ground) - - - - - - - - - - - - - - - - −3.0 V to +7.0 V Signal applied to high impedance output - - - - - - - - - - - - - - −3.0 V to +7.0 V Output current into low outputs - - - - - - - - - - - - - - - - - - 25 mA Latchup current - - - - - - - - - - - - - - - - - - - - - - - - - - > 200 mA Thermal resistance junction-to-case, θ_JC - - - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature - - - - - - - - - - - - - - - - - - - - - - - 175°C Power dissipation, P_d - - - - - - - - - - - - - - - - - - - - - - - 250 mW Lead temperature (soldering, 10 seconds)- - - - - - - - - - - - - - 275°C

Supply voltage - - - - - - - - - - - - - - - - - - - - - - - - 4.50 V ≤ V_CC ≤ 5.50 V Operating case temperature, T_C - - - - - - - - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - - - - - - XX percent 2/

intended Use: