scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access Time 01 64Kx1 CMOS SRAM (CMOS-I/O) 55 ns 02 64Kxl CMOS SRAM (TTL-I/O) 55 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive Designator Terminals Package Style X See Figure 1 36 Flat Pack Y See Figure 1 32 Rectangular leadless Chip-Carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) ------------------------------------- −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) ----------------------------------- −0.5 dc to V_CC + 0.5 V dc DC output voltage range V_OUT) ---------------------------------- −0.5 V dc to V_CC + 0.5 V dc Output voltage applied to high Z state ------------------------- −0.5 V dc to V_CC + 0.5 V dc Storage temperature range -------------------------------------- −65°C to +150°C. Lead temperature (soldering, 5 sec) ---------------------------- +250°C Thermal resistance, junction-to-case (θ_JC): Case X ------------------------------------------------------ 3.31°C/Watt Case Y ------------------------------------------------------ 3.50°C/Watt Maximum power dissipation (P_D) ---------------------------------- 1.0 Watts Maximum junction temperature (T_J) ------------------------------- +175 °C

Supply voltage range (V_CC) ------------------------------- 4.5 V dc (Min) to 5.5 V dc (Max) Supply voltage (V_SS) ------------------------------------- 0.0 V dc High level (CMOS) input voltage range (V_IH) -------------- 3.5 V dc to V_CC + 0.5 V dc High level (TTL) input voltage range (V_IH) --------------- 2.2 V dc to V_CC + 0.5 V dc Low level (CMOS) input voltage range (V_IL) --------------- −0.5 V dc to 1.5 V dc Low level (TTL) input voltage range (V_IL) --------------- −0.5 V dc to 0.8 V dc Case operating temperature range (T_C) ------------------- −55 °C to +125 °C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - - - 100 percent

intended Use: