DIN EN 62880-1
Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 August 2014 |
| Status: | inactive |
| Page Count: | 64 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN EN 62880-1
August 1, 2014
Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)
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