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DS/EN 61190-1-2

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

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Organization: DS
Publication Date: 14 July 2014
Status: active
Page Count: 30
ICS Code (Electronic component assemblies): 31.190
scope:

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of 'Reflow condition and profile' in Annex B; c) addition of a new Annex C.

Document History

DS/EN 61190-1-2
July 14, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This...
DS/EN 61190-1-2
July 2, 2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This...
DS/EN 61190-1-2
July 9, 2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. This...
DSF/FprEN 61190-1-2
Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard...
DSF/EN 61190-1-2/FprA1
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This...
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