scope:

This series of European Specifications specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. This specification also gives recommendations on the information requirements to facilitate the acceptance and use of bare die, with or without connection structures, and minimally packaged die. This part specifies the basic requirements for the data which are needed to describe the geometrical properties of die, their physical properties and the electrical connection necessary for their use in the development and manufacture of products. More detailed requirements concerning handling, test, thermal properties and simulation models are contained in ES 59008-4 whilst requirements specific to different die types are contained in ES 59008-5. ES 59008-3 should be read in conjunction with ES 59008-1: General requirements.