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SAE - GEIA SSB 1.002

Environmental Tests and Associated Failure Mechanisms

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Organization: SAE
Publication Date: 1 September 2014
Status: active
Page Count: 13
scope:

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.

This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.

Document History

GEIA SSB 1.002
September 1, 2014
Environmental Tests and Associated Failure Mechanisms
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications. This...
October 1, 1999
Environmental Tests and Associated Failure Mechanisms
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the...

References

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