Electronics assembly technology – Part 4: Endurance test methods for solder joint of area array type package surface mount devices
|Publication Date:||1 October 2014|
|ICS Code (Electronic component assemblies):||31.190|
This part of IEC 62137 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress.
This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment.
An acceleration factor for the degradation of the solder joints of the packages by the temperature cycling test due to the thermal stress when mounted, is described Annex A.
Annex H provides some explanations concerning various types of mechanical stress when mounted.
The test method specified in this standard is not intended to evaluate semiconductor devices themselves.
NOTE 1 Mounting conditions, printed wiring boards, soldering materials, and so on, significantly affect the result of the test specified in this standard. Therefore, the test specified in this standard is not regarded as the one to be used to guarantee the mounting reliability of the packages.
NOTE 2 The test method is not necessary, if there is no stress (mechanical or other) to solder joints in field use and handling after mounting.