IPC-FC-234
Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
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| Organization: | IPC |
| Publication Date: | 1 November 2014 |
| Status: | active |
| Page Count: | 36 |
scope:
This document provides guidelines for the use of PSAs in single or double sided flexible printed circuits (see Figures A2 through A8), membrane switches (see Figures A9 through A12) and component attachments (see Figures A1 and A13). In addition, the guideline describes the type of materials and processes that may be used to accomplish proper assemblies.
Purpose
This document is intended as a guide to the user by seeking answers to questions related to accepted, effective methods for the use of PSAs in FPC assemblies. The methods described herein are not specifications. PSA technology is continuously evolving such that applications and requirements may vary beyond the scope of this publication.
Document History
IPC-FC-234
November 1, 2014
Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
This document provides guidelines for the use of PSAs in single or double sided flexible printed circuits (see Figures A2 through A8), membrane switches (see Figures A9 through A12) and component...
January 1, 1998
PSA Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits
This document provides guidelines for the use of PSA's in single or double sided flexible printed circuits (see figures 3, 4, 5, 6, 7, 8, 9), membrane switches (see figures 10, 11, 12, 13) and...