IPC-SM-817
General Requirements for Dielectric Surface Mounting Adhesives
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| Organization: | IPC |
| Publication Date: | 1 December 2014 |
| Status: | active |
| Page Count: | 24 |
scope:
This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring board.
Purpose
This standard defines dielectric surface mounting adhesives
through specification of test methods and inspection criteria. The
adhesives include those intended for application by pin transfer,
syringe and screening/stenciling
Document History
IPC-SM-817
December 1, 2014
General Requirements for Dielectric Surface Mounting Adhesives
This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the...
November 1, 1989
General Requirements for Dielectric Surface Mounting Adhesives
This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the...