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BSI - BS EN 60115-2

Fixed resistors for use in electronic equipment Part 2: Sectional specification: Leaded fixed low power film resistors

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Organization: BSI
Publication Date: 4 March 2015
Status: active
Page Count: 74
ICS Code (Fixed resistors): 31.040.10

Document History

19/30389229 DC
August 6, 2019
Draft BS IEC 60115-2 Ed.4.0 Fixed resistors for use in electronic equipment. Part 2: Sectional specification: Leaded fixed low power film resistors
A description is not available for this item.
BS EN 60115-2
March 4, 2015
Fixed resistors for use in electronic equipment Part 2: Sectional specification: Leaded fixed low power film resistors
A description is not available for this item.

References

This document references:
EN IEC 60068-2-13 - Environmental testing - Part 2-13: Tests - Test M: Low air pressure
Published by CENELEC on April 1, 2021
This part of IEC 60068 specifies methods of test applicable to specimens which, during transportation, storage or in service, can be subjected to low air pressure. The object of the low air pressure...
This document references:
EN IEC 60068-2-14 - Environmental testing - Part 2-14: Tests - Test N: Change of temperature
Published by CENELEC on September 1, 2023
This document provides tests with specified ambient temperature changes to analyse their impacts on specimens.
This document references:
EN IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by CENELEC on May 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068‑2‑58. This...
This document references:
EN IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Published by CENELEC on September 1, 2021
This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or...
This document references:
EN IEC 60286-2 - Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
Published by CENELEC on December 1, 2022
This part of IEC 60286 applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. It provides dimensions and tolerances necessary to tape...
This document references:
EN IEC 60068-2-13 - Environmental testing - Part 2-13: Tests - Test M: Low air pressure
Published by CENELEC on April 1, 2021
This part of IEC 60068 specifies methods of test applicable to specimens which, during transportation, storage or in service, can be subjected to low air pressure. The object of the low air pressure...
This document references:
EN IEC 60286-2 - Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
Published by CENELEC on December 1, 2022
This part of IEC 60286 applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. It provides dimensions and tolerances necessary to tape...
This document is referenced by:
EN 60115-2 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
Published by CENELEC on January 1, 2015
This part of IEC 60115 is applicable to leaded fixed low-power film resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes)...
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