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NPFC - DI-SESS-80639

ENGINEERING CHANGE PROPOSAL (ECP)

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Organization: NPFC
Publication Date: 7 April 2015
Status: inactive
Page Count: 1
scope:

Use/relationship: An Engineering Change Proposal (ECP) provides the documentation in which the engineering change is described and how the proposed change will be implemented.

a. This DID contains the format, content, and intended use information for the data deliverable resulting from the work task described in paragraph 3.3.1 (1) of EIA-649-1 and the principles of EIA-649.

b. This DID may be used in conjunction with DI-SESS-80642, Notice of Revision (NOR). A requirement for NORs should be contractually imposed in conjunction with this DID.

c. This DID supersedes DI-CMAN-80639C and DI-SESS-81880.

d. Copies of these standards are available online at http://www.sae.org or from SAE International, 400 Commonwealth Drive, Warrendale, PA 15096-0001, Tel 877-606-7323 (inside USA and Canada) or 724-776-4970 (outside USA).

e. An electronic version of DD Form 1692, Engineering Change Proposal (ECP), is available online at http://www.dtic.mil/whs/directives/forms/index.htm.

Document History

February 11, 2020
ENGINEERING CHANGE PROPOSAL (ECP)
A description is not available for this item.
DI-SESS-80639
April 7, 2015
ENGINEERING CHANGE PROPOSAL (ECP)
Use/relationship: An Engineering Change Proposal (ECP) provides the documentation in which the engineering change is described and how the proposed change will be implemented. a. This DID contains...
September 30, 2000
ENGINEERING CHANGE PROPOSAL (ECP)
Use, Relationships: An Engineering Change Proposal (ECP) provides the documentation in which the engineering change is described. It includes change impacts to systems, configuration items and other...
January 13, 1995
ENGINEERING CHANGE PROPOSAL (ECP)
A description is not available for this item.
April 17, 1992
ENGINEERING CHANGE PROPOSAL (ECP)
A description is not available for this item.
July 15, 1988
ENGINEERING CHANGE PROPOSAL (ECP)
A description is not available for this item.
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